TDK ceramic chip capacitor

In order to realize the miniaturization and large capacity of the multilayer ceramic chip capacitors, we pursue the ultra-fine particle size through advanced material technology. We use the unique technology to establish a high-level stacking technology without dislocation of dielectric layer and electrode layer and a multi-layer technology of up to 1000 layers. The interlaminar thickness of layer 1 reaches the level of submicron. Through the pursuit of thin-layer and multi-layer, even the smallest chip size can also achieve the high capacity and high reliability close to tantalum capacitors.